1. Devices
  2. MAX32570-71
  3. MAX32571

MAX32571

Maxim
  • Core

    Cortex-M4, 96 MHz

  • Family

    MAX32570-71

  • CMSIS Pack

    MAX32570

DARWIN is a new breed of low-power microcontrollers built to thrive in the rapidly evolving Internet of Things (IoT). They are smart, with the biggest memories in their class, and a massively scalable memory architecture. They run forever, thanks to wearable-grade power technology. They are durable enough to withstand the most advanced cyberattacks. DARWIN microcontrollers are designed to run any application imaginable - in places where you would not dream of sending other microcontrollers.
Generation UB microcontrollers are designed to handle the increasingly complex applications demanded by today's advanced battery powered devices and wirelessly connected devices, while providing robust hardware security and Bluetooth(R) 5 Low Energy (BLE) radio connectivity.
The MAX32570 UB class microcontrollers are advanced systems-on-chips featuring an Arm(R) Cortex(R)-M4 with FPU CPU for efficient computation of complex functions and algorithms with integrated power management. They also include the newest generation Bluetooth 5 Low Energy radio with support for long range (4x) and high throughput (2Mbps) and Maxim's best-in-class hardware security suite trust protection unit (TPU). The devices offer large on-board memory with 1MB flash and up to 560KB STAM that can be configured as 447KB SRAM with error correction coding (ECC). Split flash banks and 512KB each support seamless over the air upgrades, adding an additional degree of reliability. Memory scalability of data (SRAM) and code (flash) space is supported two SPI execute-in-place (SPIX) interfaces.
Multiple high-speed interfaces are supported included HS_USB, secure digital interface (SD, SDIO, MMC, SDHC, and microSD(tm)), SPI, UART, and I2C serial interfaces, and TDM interfaces. An 8-input 10-bit ADC is available to monitor analog inputs from external sensors and meters. The devices are available in 109-bump WLP (0.35mm pitch) and 121-bump CTBGA (0.65mm pitch) packages.

  • Features

    Device

    MAX32571

  • Memory

    IRAM1 512 KiB
    IROM1 1 MiB